| 摘要 |
PROBLEM TO BE SOLVED: To reduce the contact heat resistance between a cooling body and a deposition-proof plate even if the deposition-proof plate is thermally deformed and to lower the temp. of the deposition-proof plate. SOLUTION: In a vacuum vessel 10, a cooling body (substrate electrode) 12 and a target electrode 14 are arranged so as to be relatively confronted with each other, a deposition-proof plate 26 is attached to the cooling body 12 through a cooling plate 24, and a substrate 32 is inserted into the opening part of the deposition-proof plate 26. In a stage where discharge is executed on the space between the cooling body 12 and the target electrode 14, and the target electrode 14 is sputtered to deposit sputtering particles on the deposition-proof plate 26 and the substrate 32, even if the deposition-proof plate 26 is thermally deformed, since plural projections have been formed on the cooling plate 24, elasticity occurs on the whole of the cooling plate 24, and the cooling plate 24 can follow the thermal deformation of the deposition-proof plate 26.
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