EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high soldering resistance under moisture absorption, and excellent moldability. SOLUTION: This invention relates to the epoxy resin composition including the epoxy resin, a curing agent, an accelerating agent and an inorganic filler as the essential components. The low hygroscopicity and high adhesiveness of the epoxy resin composition are enhanced by including at least two components comprising dicyclopentadiene type epoxy resin and bisphenol-F type epoxy resin as the epoxy resin. The soldering resistance under moisture absorption is improved by including 80 to 93 wt.% of the inorganic filler in the whole composition while retaining excellent moldability.