发明名称 Support structure, electronic assembly
摘要 An electronic assembly (10) includes a chip capacitor (11) having two major surfaces (12, 15) and a pair of electrodes (13, 14). A plurality of electrically conductive traces (20-23, 25-28) are formed on one (12) of the major surfaces. Some of the plurality of electrically conductive traces are electrically coupled to a first electrode (14) and some of the plurality of electrically conductive traces are coupled to a second electrode (14) of the pair of electrodes. Electronic circuit elements (16, 17, 18) are coupled to the plurality of electrically conductive traces (20-23, 25-28), thereby forming the electronic assembly (10).
申请公布号 US6046901(A) 申请公布日期 2000.04.04
申请号 US19980072196 申请日期 1998.05.04
申请人 MOTOROLA, INC. 发明人 DAVIS, BENJAMIN R.;WEBB, BRIAN A.
分类号 H01L23/64;H05K1/03;H05K1/16;H05K3/40;(IPC1-7):H01G4/005;H01G4/228;H05K1/18 主分类号 H01L23/64
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