发明名称 |
Process for fabricating a crack resistant resin encapsulated semiconductor chip package |
摘要 |
A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part between the semiconductor chip and the lead frame with a sealant. The adhesive has a coming-out length of not more than 2 mm and a water absorption rate of not more than 3 wt. %. Preferably, the adhesive has a glass transition point of at least 200 DEG C.
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申请公布号 |
US6046072(A) |
申请公布日期 |
2000.04.04 |
申请号 |
US19980044575 |
申请日期 |
1998.03.19 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MATSUURA, HIDEKAZU;IWAZAKI, YOSHIHIDE;OHTA, NAOTO |
分类号 |
H01L23/495;(IPC1-7):H01L21/60 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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