发明名称 Method of forming capacitors and related integrated circuitry
摘要 Capacitor constructions and methods of forming the same are described. In one implementation, a capacitor container is formed over a substrate and includes an internal surface and an external surface. At least some of the external surface is provided to be rougher than at least some of the internal container surface. A capacitor dielectric layer and an outer capacitor plate layer are formed over at least portions of the internal and the external surfaces of the capacitor container. In another implementation, a layer comprising roughened polysilicon is formed over at least some of the external container surface but not over any of the internal container surface. In a preferred aspect, the roughened external surface or roughened polysilicon comprises hemispherical grain polysilicon.
申请公布号 US6046093(A) 申请公布日期 2000.04.04
申请号 US19970876057 申请日期 1997.06.13
申请人 MICRON TECHNOLOLGY, INC. 发明人 DEBOER, SCOTT J.;SCHUEGRAF, KLAUS F.;THAKUR, RANDHIR P. S.
分类号 H01L21/02;H01L27/108;(IPC1-7):H01L21/20 主分类号 H01L21/02
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