| 摘要 |
An ultra-thin dielectric film is subject to a dynamic electrical bias. During a first phase, the ultra-thin dielectric film is under a high field bias generated by the application of a high voltage. The duration of the high electrical stress is dependent on the intrinsic properties of the ultra-thin dielectric material. In a second phase, the ultra-thin dielectric film is subjected to an operating field bias generated by the application of an operating voltage. The change in the field bias exposes the dielectric to a similar dynamic stress that microelectronic devices ordinarily experience. At the operating field stage, a gate current is measured and compared to a predetermined range. Once the gate current exceeds that range the test concludes. Otherwise, the test cycles between the above-mentioned phases for a predetermined number of iterations based on prior experimental correlation. In a destructive testing mode, the process is continuous and does not conclude until the gate current exceeds a predetermined range. The ultra-thin dielectric gate current may also be measured as the ultra-thin dielectric is heated so that the transport properties or reliability of the ultra-thin dielectric is more clearly understood.
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