发明名称 MANUFACTURE OF BOX BODY FOR ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To manufacture a thin and light-weight box body at a good yield by forming the box body thicker than a prescribed thickness with casting for helping molten metal fluidity and thereafter, machining it to a prescribed shape. SOLUTION: A box body for an electronic device having <=1 mm thickness is manufactured. This box body is formed thicker than a prescribed thickness with casting as shown in a figure (a-1) and thereafter, the box body is removed to the desired thickness as shown in a figure (a-2) to make a thin formed product. It is desirable that the box body is formed by providing a projecting part 1 for helping molten metal fluidity as shown in a figure (b-1) and the whole or a part of the projecting part 1 is removed to make the thin box body for an electronic device as shown in a figure (b-2). A part of the projecting part 1 is left and made as a rib or a boss. A heat pipe for cooling electronic parts is embedded in the projecting part 1 and the thermal absorption of the electronic parts is made good. The contacting area between the molten metal and a metallic mold is made small to be hardly cooled by forming the projecting part 1 in an almost cylindrical shape.
申请公布号 JP2000094108(A) 申请公布日期 2000.04.04
申请号 JP19980267518 申请日期 1998.09.22
申请人 SHARP CORP 发明人 MATSUDA TAKESHI;ASAI SHIGEMI
分类号 B22D19/00;B22D17/00;B22D17/22;B29C45/00;H05K5/02;(IPC1-7):B22D17/00 主分类号 B22D19/00
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