发明名称 Adhesive tape for electronic parts
摘要 This invention provide an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises adhesive layers composed of at least a polyimide comprising the repeating units represented by the formulas (1) and (2) on both sides of the substrate, one of said adhesive layer having a higher glass transition temperature than that of the other adhesive layer: wherein X is -SO2- and/or -C(=O)-OCH2CH2O-C(=O)-, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or -CH2OC6H4-, and n means an integer of 1 to 20. The stustrate may be a resin layer composed of the above mentioned polyimide.
申请公布号 US6045886(A) 申请公布日期 2000.04.04
申请号 US19970998019 申请日期 1997.12.24
申请人 TOMOEGAWA PAPER CO., LTD. 发明人 OKA, OSAMU;NISHIGAYA, TAKESHI
分类号 C09J7/02;C09J179/08;H01L23/495;(IPC1-7):B32B7/12;H01L23/29 主分类号 C09J7/02
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