发明名称 |
Adhesive tape for electronic parts |
摘要 |
This invention provide an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises adhesive layers composed of at least a polyimide comprising the repeating units represented by the formulas (1) and (2) on both sides of the substrate, one of said adhesive layer having a higher glass transition temperature than that of the other adhesive layer: wherein X is -SO2- and/or -C(=O)-OCH2CH2O-C(=O)-, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or -CH2OC6H4-, and n means an integer of 1 to 20. The stustrate may be a resin layer composed of the above mentioned polyimide.
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申请公布号 |
US6045886(A) |
申请公布日期 |
2000.04.04 |
申请号 |
US19970998019 |
申请日期 |
1997.12.24 |
申请人 |
TOMOEGAWA PAPER CO., LTD. |
发明人 |
OKA, OSAMU;NISHIGAYA, TAKESHI |
分类号 |
C09J7/02;C09J179/08;H01L23/495;(IPC1-7):B32B7/12;H01L23/29 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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