| 摘要 |
PROBLEM TO BE SOLVED: To eliminate occurrence of a deformation such as a wrinkle or the like at an adhesive film and to improve a manufacturing yield, by sandwiching a base material to be laminated and the film between upper and lower thin metal plates, heating and pressurizing them, and then cooling them while pressurizing as they remain sandwiched between the plates. SOLUTION: A conductive film 20 is formed on a front surface of a film 20 made of a polymer organic film, and a connecting terminal of an IC chip 22 is connected onto that of the film 20. A film 30 of an upper side coated with an adhesive 32 is mounted on the film 10. In this case, both the films 10, 30 are sandwiched between both upper and lower metal plates 40 and 42, hot pressed as they are so that both the films 10 and 30 are adhered and laminated. Thereafter, while both the plates 40 and 42 remain close contact with both the films 10, 30, they are cold pressed. At this time, deformations of the films 10, 30 are suppressed by the plates 40, 42 to prevent deformations such as wrinkles or the like at both the films 10, 30. |
