| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device tray wherein a semiconductor device can be downsized and quality of the device can be improved. SOLUTION: In order to receive a package 9 having a plurality of solder balls 10 on a bottom, a solder ball pocket 14 for receiving each solder ball 10 of the package 9 is provided on a mount 11A of the package 9 of a tray 11, wherein a partition 15 of each solder ball pocket 14 supports a part between the solder balls 10 of the package 9. The solder ball pocket 14 is formed to be of a size for receiving the solder ball 10, while a depth (d) of the solder ball pocket 14 is formed to be larger than a height (e) of the solder ball 10.
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