发明名称 Method of manufacturing a 2-layered flexible substrate
摘要 A method of manufacturing a 2-layered flexible substrate includes forming an underlying metal layer on an insulation film with a deposition layer formed by a dry plating method using at least one of nickel, copper-nickel alloy, chromium and chromium oxide and a copper deposition layer formed by a dry plating method on the noted deposition layer, then forming a primary electric copper plated deposition layer on the underlying metal layer, then applying a treatment using at least one alkaline solution selected from inorganic alkaline solutions and organic alkaline solutions, then forming an electroless copper plated deposition layer as an intermediate metal layer on the primary electric copper plated deposition layer and, finally, forming a secondary electric copper plated deposition layer on the intermediate metal layer, thereby finally forming a copper conductor layer of 1 to 35 mu m thickness on the insulation film.
申请公布号 US6045713(A) 申请公布日期 2000.04.04
申请号 US19970970210 申请日期 1997.11.14
申请人 SUMITOMO METAL MINING CO., LTD. 发明人 TAMIYA, YUKIHIRO;SAKURADA, TAKEHIKO;TAKABATAKE, TOSHINOBU;SUGIURA, TAKASHI
分类号 H05K1/09;B32B15/08;B32B15/20;C23C14/20;C23C28/02;H05K1/00;H05K3/00;H05K3/10;H05K3/24;H05K3/38;(IPC1-7):B22C1/22 主分类号 H05K1/09
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