Lead frame supplying method and apparatus

摘要

A lead frame supplying method and apparatus used with, for instance, a wire bonding machine, including a sensor which detects a presence or absence of a lead frame in a frame storing section of a lead frame magazine. The sensor is installed at the level of a frame conveying path or above the level of the frame conveying path of a frame feeder that feeds lead frames to, for instance, the bonding machine and is located so that the lead frame magazine is positioned between the sensor and the frame feeder. In addition, a control unit positions a frame storing section that contains a lead frame at the level of the frame conveying path of the frame feeder when the sensor detects the absence of a lead frame in one frame storing section.