MOLDING METHOD AND APPARATUS FOR POROUS SILICON WAFER

摘要

PURPOSE: A method and an apparatus for forming a porous silicon wafer is provided to form continuously a porous silicon wafer having an identical size by using an electrolysis method. CONSTITUTION: A pattern(22) is formed on one side of an electrode(20) by using an oxide layer. The electrode(20) is inserted into case(10). An electrolysis solution(16) is put into the case(10). Another electrode(50) is formed on the case(10). A silicon wafer(60) is fixed to one side of the electrode(50). A case room(40) including a conductive solution(42) is inserted into the case(10). The electrode(20) is approached to the silicon wafer(60). An electric power is applied to the electrodes(20,50).