| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist coating apparatus for sucking and fixing a warped wafer to a spin head with sufficient suction force without a crack or a split of the wafer, while the wafer is prevented from spinning out during rotation of the spin head. SOLUTION: A resist coating apparatus has a spin head having a rotatably round shape and a suction groove 13 opened on an upper face. A silicon wafer 18 used for a semiconductor is coated with resist by vacuum suction. In this case, the suction groove 13 has an inner circumferential part as a vertically movable part 21. The inner circumferential part moves in accordance with the shape of the warped wafer, so a vacuum suction groove 13 and the wafer 18 are put in contact completely. In addition, by sticking an elastic material to a suction face of the spin head, a junctional area can be increased to improve suction. Then, the wafer 18 can be prevented from spinning out during the rotation. At the same time, stress for extending the wafer in direction reverse to the warp can be reduced, and a crack or a split in the wafer 18 caused by vacuum suction can be prevented. |
