发明名称 OPTIMIZED COATING METHOD OF ADHESIVE
摘要 PROBLEM TO BE SOLVED: To coat a specified position of a circuit board efficiently with a given coating quantity of adhesive by classifying the coating position of adhesive depending according to the type of coating nozzle and rearranging the coating order such that the coating positions are continuous and an identical coating quantity is set for each coating nozzle. SOLUTION: At first, a coating quantity to be optimized and a range of moving distance of a coating nozzle are set (S1). Subsequently, the type of nozzle to be optimized is selected (S2) and a coating quantity to be optimized is determined (S3). Since the coating quantity is sectioned in units of 10 ms, production block set for each coating quantity is selected in the order of 10 ms, 20 ms, 30 ms and 40 ms (S4). Furthermore, an order for minimizing the moving distance between respective production blocks is determined when a plurality of production blocks are present for each selected coating quantity (S5). Thereafter, production block of coating program is rearranged (S6), the processing is executed for each coating quantity (S7) and for each coating nozzle (S8).
申请公布号 JP2000091738(A) 申请公布日期 2000.03.31
申请号 JP19980258924 申请日期 1998.09.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KINOU TOSHIYUKI;NAKAHIRA HITOSHI;KAKISHIMA NOBUYUKI;TERAYAMA EIICHIRO
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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