发明名称 Hg-BASED II-VI COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To increase both the resolution and the withstanding voltage of an HgCdTe semiconductor device by making the carrier density near a pn junction on the surface of a p-type Hg-based II-VI compound semiconductor substrate smaller than that in a bulk. SOLUTION: In a p-type Hg-based II-VI compound semiconductor substrate 1, an n-type region 2 which constitutes a one-dimentional or two-dimentional photodiode array is formed. The surface of the p-type Hg-system II-VI compound semiconductor substrate 1 is treated with excited hydrogen to make the carrier density in part of the surface of the substrate near the n-type region 2 smaller than that in a bulk. Then, a pn junction 3 is formed in that region where the carrier density is smaller than that in a bulk. Thereby, both the resolution and the withstanding voltage of an HgCdTe semiconductor device can be increased.
申请公布号 JP2000091620(A) 申请公布日期 2000.03.31
申请号 JP19980254910 申请日期 1998.09.09
申请人 FUJITSU LTD 发明人 FUJIWARA KOJI;SUDO HAJIME;ARINAGA KENJI;MIYATAKE TETSUYA
分类号 H01L21/205;H01L27/14;H01L31/10;(IPC1-7):H01L31/10 主分类号 H01L21/205
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