| 摘要 |
PROBLEM TO BE SOLVED: To control temperature for each mounted optical element even if a plurality of elements are mounted on the same substrate by cooling the rear surface of the substrate to a constant temperature. SOLUTION: A clad layer 2 is formed on a substrate 1, a heater 15, an insulating layer 16, an electrode 15, and a solder film 6 are laminated in this order over the layer, the height of an insulator layer is so worked that an optical waveguide formed on the substrate 1 and the output light of a semiconductor optical element 7 mounted on the substrate 1 couple each other, the semiconductor optical element 7 is so flip-chip-bonded that an active layer 9 comes to just above the heater 15, the heater 15 is applied with a current to control the temperature of an optical element active layer, so that, even if a plurality of optical elements are mounted on the same substrate, the temperature is controlled for each mounted optical element by cooling the rear surface of the substrate to a constant temperature. |
