| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package, which can increase the number of packages per unit wafer, improve the yield and reliability and reduce the number of necessary processing steps, and also to provide a structure of the package. SOLUTION: The method includes steps of forming bumps for each of semiconductor chips 105 forming a semiconductor package 100 on a semiconductor wafer 101, dicing a pre-prepared substrate 10 into substrate pieces 10a corresponding to the semiconductor chips, die bonding the diced substrate pieces on the semiconductor wafer in association with the semiconductor chips having the bumps formed thereon, sealing spaces between the die-bonded semiconductor wafer and substrate pieces with resin 104, and dicing the resin-sealed wafer and substrate pieces into the semiconductor packages. |
