发明名称 SOLID IMAGE PICKUP DEVICE
摘要 PROBLEM TO BE SOLVED: To enable the charge in a photodiode layer at low voltage to be read out even if a surface shield structure is adopted in a CMOS image sensor. SOLUTION: For example, a surface shield layer 17 is formed separate from the end of a read out gate 14 on the surface of a photodiode layer 16. Next, an impurity region 21 in higher concentration than that of the photodiode layer 16 is formed between this surface shield layer 17 and the read out gate 14. Through these procedures, the formation of potential barrier by the surface shield layer 17 is suppressed for facilitating reading of the charge accumulated in the photodiode layer 16, thereby enabling the read out voltage to be lowered.
申请公布号 JP2000091552(A) 申请公布日期 2000.03.31
申请号 JP19980258714 申请日期 1998.09.11
申请人 TOSHIBA CORP 发明人 HORI MIKIKO;SHIOYAMA YOSHIYUKI;ABE SEIGO;IGUMA HIDEMIKI;SHIBATA HIDENORI;MAKABE AKIRA;NOMACHI EIKO;NARUSE HIROSHI;INOUE IKUKO;MATSUNAGA MASAYUKI;IHARA HISANORI;NAKAMURA NOBUO;YAMAGUCHI TETSUYA;YAMASHITA HIROSHI;NOZAKI HIDETOSHI
分类号 H01L27/146;H01L27/148;H04N5/335;H04N5/341;H04N5/361;H04N5/369;H04N5/372;H04N5/374;(IPC1-7):H01L27/146 主分类号 H01L27/146
代理机构 代理人
主权项
地址