| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a device of a semiconductor chip, etc., with high accuracy by exposing a fine pattern in such a way that the exposed area becomes sufficiently larger to contain the whole area of an in-chip device forming area on one chip formed on a substrate. SOLUTION: An area for forming a fine line pattern 401 is formed (exposed) on the whole surface of a substrate so that the area may contain an input-output buffer circuit and become slightly larger than an device in chip forming area 404 in a semiconductor chip 101. The area 404 contains a connecting area for electrically connecting an active element, such as a MOS transistor, a bipolar transistor, a diode, etc., a passive element, such as a resistance element, a capacitance element, etc., and the whole or partial area of a connecting area of electrically connecting the active element and passive element. Namely, the area 404 is an area containing an internal circuit, a peripheral circuit, and a connecting area for connecting the circuits in the semiconductor chip 101.
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