| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-performance semiconductor acceleration sensor element capable of mitigating a thermal stress on a sensor chip from the outside, and having an excellent temperature characteristic. SOLUTION: This acceleration sensor element has a frame-shaped frame 1, a flexible part 2 having a center part 2a and beam parts 2b, a stacked part 3, and a support member 6. The flexible part 2 is stretched in four directions from a peripheral edge of the center part 2a avoiding center lines C-C', D-D' of the flexible part 2 forming surface of this semiconductor acceleration sensor element, and the beam parts 2b are formed so as to be rotationally symmetrical relative to the flexible part 2 forming surface of the semiconductor acceleration sensor element. The stacked part 3 is connected to the center part 2a through a neck part 3a, and hereby a cutout groove 4 is formed between the stacked part 3 and the beam parts 2b. Besides, the support member 6 is installed so as to encircle the stacked part 3 through a cutout part 5 and to support the under surface side of the frame 1. The cutout part 5 is formed so as to link to the cutout groove 4. |
