发明名称 METHOD FOR CONSTRUCTING SEMICONDUCTOR WAFER PRODUCTION PROCESS SYSTEM
摘要 PROBLEM TO BE SOLVED: To realize a method for constructing a semiconductor wafer production process system capable of lessening a conveying distance of a wafer and taking partial charge of works appropriately in each operator. SOLUTION: This embodiment comprises a work unit dividing process of dividing a production process of a semiconductor wafer (step 101); a work module preparing process of collecting work units using the same facilities in combination (step 102); a work module group preparing process of allocating facilities in combination of a plurality of work modules from use frequencies of each facility in the work module, and setting this combination as a work module group (steps 103, 104); a work module group proximity evaluating process of evaluating proximity from frequencies of the number of times of transfer between work module groups in the production process (step 105); and a layout process of laying out the work module group near the work module group having high proximity centering the work module group having high use frequencies (step 106).
申请公布号 JP2000091179(A) 申请公布日期 2000.03.31
申请号 JP19980258761 申请日期 1998.09.11
申请人 SONY CORP 发明人 IMAI MICHIO;MATSUZAKI AKINORI;ONO KAZUTOSHI;KIZAKIHARA TOSHIRO
分类号 H01L21/677;H01L21/02;H01L21/68;(IPC1-7):H01L21/02 主分类号 H01L21/677
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