发明名称 |
METHOD FOR CONSTRUCTING SEMICONDUCTOR WAFER PRODUCTION PROCESS SYSTEM |
摘要 |
PROBLEM TO BE SOLVED: To realize a method for constructing a semiconductor wafer production process system capable of lessening a conveying distance of a wafer and taking partial charge of works appropriately in each operator. SOLUTION: This embodiment comprises a work unit dividing process of dividing a production process of a semiconductor wafer (step 101); a work module preparing process of collecting work units using the same facilities in combination (step 102); a work module group preparing process of allocating facilities in combination of a plurality of work modules from use frequencies of each facility in the work module, and setting this combination as a work module group (steps 103, 104); a work module group proximity evaluating process of evaluating proximity from frequencies of the number of times of transfer between work module groups in the production process (step 105); and a layout process of laying out the work module group near the work module group having high proximity centering the work module group having high use frequencies (step 106). |
申请公布号 |
JP2000091179(A) |
申请公布日期 |
2000.03.31 |
申请号 |
JP19980258761 |
申请日期 |
1998.09.11 |
申请人 |
SONY CORP |
发明人 |
IMAI MICHIO;MATSUZAKI AKINORI;ONO KAZUTOSHI;KIZAKIHARA TOSHIRO |
分类号 |
H01L21/677;H01L21/02;H01L21/68;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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