| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding structure and wire bonding with which the bonding strength with a lead frame, etc., can be maintained high, and to provide a capillary suitable for a wire bonding. SOLUTION: When a wire 5 is subjected to wedge-bonding on the surface of a lead 3, a wedge 5a is formed on the tip of the wire 5, using a capillary 6 provided with the curved surface first pressure lower surface 6c formed around a tip edge 6b and a second pressure lower surface 6d formed annular on the curved surface first pressure lower surrace 6c and around it, and in addition, the part linking to a wedge 5a made to approach and connect to the surface of the lead 3, a flat part 5b is formed and the bonding strength to the surface of the lead 3 is strengthened. |
