CHIP-SIZE PACKAGE AND PRINTED CIRCUIT BOARD DEVICE MOUNTED THEREWITH

摘要

PROBLEM TO BE SOLVED: To secure the connection reliability of a chip-size package(CSP) mounted on a printed circuit board (motherboard) with a simple structure by securing the reliability of connection between the circuit of the internal circuit board of the CSP and the electrodes of a chip. SOLUTION: This chip-size package is formed by forming the package- incorporated circuit board to which the electrodes of the chip 1 are connected and fixed by using a thermosetting resin containing Aramid (R) fiber base material, and dispersing rubber elastic particulates which are incompatible with thermosetting resin in the thermosetting resin. Furthermore, an insulating layer on the top surface of the printed circuit board 5 (motherboard), where the CSP is mounted is also formed of a thermosetting resin containing Aramid (R) fiber base material and rubber elastic particulates which are incompatible with the thermosetting resin are dispersed in the resin.