| 摘要 |
PROBLEM TO BE SOLVED: To secure satisfactory conduction states among a plurality of wiring layers, in a semiconductor device having multilayer wiring structure by embedded wirings. SOLUTION: A lower wiring 12 is formed with a conductive material. An upper wiring 38 is formed with the conductive material. Insulating layers 14, 16 and 18 are installed between the lower wiring 12 and the upper wiring 38. The lower wiring 12 and the upper wiring 38 are made to be conduction in states through the insulating layers 14, 16 and 18, and a connection part 36 having a cross sectional area larger than that of the lower wiring 12 side is installed on the upper wiring 38 side. |
