| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable accurate measurement of the temperature, flatness, vibration, etc., of a wafer with a simple mechanism without incurring an increased cost. SOLUTION: The polishing apparatus comprises a rotatable platen 11 having a polishing pad 12 mounted thereon, a temperature sensor 21 for measuring properties (flatness, temperature, vibration, etc.), of the pad 12 from an upper side of the pad 12, guide mechanism 17 for carrying the temperature sensor 21 and for moving the sensor 21 along a main surface of the pad, and an air nozzle for removing liquid on the pad 12.</p> |
