发明名称 HEAT RADIATING BOARD FOR FLOOR HEATING
摘要 PROBLEM TO BE SOLVED: To facilitate the burying work of a flexible fluid pipe for heat medium and reduce the generation of uncomfortable sound or collision sound when heat medium is passed through the flexible fluid pipe for heat medium by a method wherein the flexible fluid pipe for heat medium, buried in the internal space of a groove, is retained surely. SOLUTION: In a heat radiating board 10 for floor heating, consisting of a flat plate type base body, a plurality of parallel grooves 11 and a curved grooves for connecting the end parts of these parallel grooves 11 are engraved in one surface of the same while these grooves are formed so as to have U-shaped sectional configuration orthogonal to the lengthwise direction of these grooves. In this case, a plurality of projected parts 12, 12', which are projected slightly toward the space of the groove from the inner wall surface of the same, and/or a plurality of recessed parts, recessed slightly from the inner wall surface of these grooves, are provided at proper positions on the inner wall surfaces of the grooves.
申请公布号 JP2000088260(A) 申请公布日期 2000.03.31
申请号 JP19980262205 申请日期 1998.09.17
申请人 MITSUBISHI KAGAKU SANSHI CORP 发明人 SASAKI TAKASHI;SUEYOSHI KOJI
分类号 F24D3/16;(IPC1-7):F24D3/16 主分类号 F24D3/16
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