发明名称 RELEASE AGENT COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a release agent compsn. for resist capable of easily releasing even a resist deformed by high energy treatment in a short time and reduced in the corrosion of a metallic member such as a wiring material. SOLUTION: This compsn. for the resist is prepared by compounding a compd. having a heterocycle and carboxyl groups or -C(O)-NH2 groups in the molecule, org. polar solvent and water. Or, the compsn. is prepared to contain a compd. having a heterocycle and carboxyl groups or -C(O)-NH2 groups in the molecule, org. polar solvent and water. In this compsn., the org. polar solvent is preferably one or more kinds selected from dimethyl formamide, N- methyl-2-pyrrolidone, dimethyl imidazolidinone, dimethyl sulfoxide and compds. expressed by the formula of R1(X)(AO)nR2. In the formula, R1 is a hydrogen atom or 1-12C hydrocarbon group, X is -O-, -COO-, -NH- or -N((AO)nH)-, m and n are 1 to 20, A is a 2-3C alkylene group, R2 is a hydrogen atom or 1-8C hydrocarbon group.
申请公布号 JP2000089481(A) 申请公布日期 2000.03.31
申请号 JP19980255696 申请日期 1998.09.09
申请人 KAO CORP 发明人 KITAZAWA KOZO;KASHIHARA EIJI;SHIROTA MASAMI
分类号 H01L21/027;G03F7/42;(IPC1-7):G03F7/42 主分类号 H01L21/027
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