| 摘要 |
PROBLEM TO BE SOLVED: To bury the inside of a groove in an excellent burying shape by making a solid part ratio as a specified volume ratio or more. SOLUTION: A rate of solid parts such as metal, glass or resin left on a substrate at the time of curing for the whole of paste is made 60 volume % or more, the solid parts are buried into a groove by a squeegee and degradation of a burying shape due to volume contraction after solvent is volatilized is prevented. It is desirable that a viscosity ratio when a rotation frequency of a rotation viscosimeter is changed by a figure is made 2 or below, a rise in viscosity at a groove bottom part of buried paste is suppressed, and a connection defective or void is not generated. It is desirable that paste constituting a connecting plug buried within a connection hole and including powder of different average particle diameters includes 10% or more of paste which is large in surface area and has an average particle diameter of 3μm or more, a crack is not generated and viscosity is lowered. A method in which dispersed solution of powder that glass melting at the time of baking is a part is applied to an area including a groove of a surface of the substrate and the inside of the groove is buried by precipitated powder is desirable.
|
