| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a probe card more inexpensively than the case of being used in measuring the electrical characteristics of a semiconductor integrated circuit having a more-complicated arrangement pattern of a recent bonding pad. SOLUTION: This probe card, for measuring the electrical characteristics of a semiconductor integrated circuit 800, as a measurement object, on which peripheral bonding pads 810 are formed on the peripheral part and central bonding pads 820 are formed on the center part respectively, has horizontal probes 100 for contacting with the peripheral bonding pads 810, a first board 300 for installing the horizontal probes 100 thereon, vertical probes 200 for contacting with the central bonding pads 820, a second board 600 for installing the vertical probes 200 thereon, and an interval adjusting mechanism 750 for adjusting the interval between the second board 600 and the first board 300.
|
