发明名称 CIRCUIT FORMATION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To easily polish TiN after a thermal treatment and enable easy polishing of Cu or Al, by adding HNO3 to abrasives which uses MnO2 as abrasive grains. SOLUTION: An electrode contact hole is formed on an insulating film (e.g. an interlayer insulating film 3 composed of SiO2), and a metal material layer (e.g. a conducting plug material layer composed of W) is formed on the whole surface. The metal material layer is polished with abrasives containing abrasive grains composed of MnO2 and additive forming NO3, and a conducting plug (e.g. a conducting plug 5P) is formed. The additive forming NO3 is HNO3. As a result, performance of MnO2 abrasives is improved, and polishing speed of W, Cu and Al is improved. TiN also can be easily polished irrespective of thermal history.</p>
申请公布号 JP2000091284(A) 申请公布日期 2000.03.31
申请号 JP19980253727 申请日期 1998.09.08
申请人 FUJITSU LTD 发明人 KISHII SADAHIRO;ARIMOTO YOSHIHIRO
分类号 H01L21/3205;B24B37/00;H01L21/304;H01L21/321;H01L21/768;(IPC1-7):H01L21/304;H01L21/320 主分类号 H01L21/3205
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