发明名称 |
INSULATION COATED MEMBER, WIRING BOARD EMPLOYING IT AND PRODUCTION THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To make a highly reliable through hole at the core part by providing an electrodeposition insulating material coating the entire surface of a metal basic material so that fine pattern wiring and multiplayer wiring can be accomplished. SOLUTION: First embodiment (fig. a) is a wiring board having a wiring part of a metal layer 140 formed on the side not subjected to surface plating. The wiring part 140 is connected electrically with an external electronic part 138 through a through hole filled with metal plating 130. Second embodiment (fig. b) represents a wiring part 155 transferred through an insulation layer 150 and the transferred wiring part 155 conducts with the underlying metal layer 140 through conductive paste 160. Third embodiment (fig. c) is a wiring board having a wiring part 155 formed in two layer. The underlying wiring part 155 is connected electrically with the metal plating part 130 through a conductive paste 160 and the wiring part 155 is connected electrically with the external electronic part 138 through the through hole filled with metal plating 130. |
申请公布号 |
JP2000091719(A) |
申请公布日期 |
2000.03.31 |
申请号 |
JP19980360299 |
申请日期 |
1998.12.18 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
KURAMOCHI SATORU |
分类号 |
H05K1/05;C25D7/00;C25D13/00;H05K1/11;H05K3/40;H05K3/46;(IPC1-7):H05K1/05 |
主分类号 |
H05K1/05 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|