| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress a thermal deformation and a constant change of a molding material by constituting an element body covered with a sheath having a wavy protrusion and recess part formed on a surface and electrodes for connecting the body to a circuit board. SOLUTION: The chip component is obtained by welding electrodes 4 to both ends of a resistor element body 3 and covering the body 3 around with a sheath 2. The body 3 is formed by punching a plate material made of a copper nickel alloy, an iron chromium alloy, a nickel chromium alloy or the like in a zigzag shape while retaining welding connecting parts at both the ends. The body 3 is covered with a high heat resistant resin molding material while exposing the electrodes 4 to be electrically welded to the connecting parts. Here, in the case of a covering step, a fine wavy protrusion and recess part 1 is formed in a mold cavity used for molding, and the part 1 of the cavity is copied on a surface of the sheath obtained by injection molding.</p> |
