DIE PICK-UP METHOD, SEMICONDUCTOR MANUFACTURING DEVICE USING THE SAME, AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the yield of dies at picking up of the dies and the availability of a semiconductor manufacturing device having pick-up function. SOLUTION: A semiconductor manufacturing device is provided with a pick-up mechanism 24, having a thrust-up piece 6 and thrust-up needles 7 which thrust up a wafer tape 30 stuck to the non-circuit forming surface of a diced semiconductor wafer from the wafer, a chuck collet 32, which picks up and holds by chucking a die 2 thrust up by the needles 7, and a tape retaining member 29 which presses down the wafer tape 30, when the needles 7 thrust up the die 2. Therefore, the thrust-up of the die 2 is performed, while the tape retaining member 29 gives tension to the wafer tape 30 by pressing down the tape 30.