| 摘要 |
PROBLEM TO BE SOLVED: To planarize the bumps on a packaging surface by polishing the surfaces of the bumps together with semiconductor substrate after bumps for metal wiring connection are formed on an electrode pad leading to the circuit of a semiconductor device. SOLUTION: Bumps 102 for a metal wiring connection are formed on an electrode pad leading to the circuit of a semiconductor device. To polish the surfaces of the bumps 102 on the substrate 101 of the semiconductor device, the substrate 101 is set on a polishing surface board 103 having a motion mechanism of rotation, oscillation and a combination of them with the bumps 102 faced down to the side of the surface board 103 where a polishing agent 104 is supplied. The roughness of the pad of the surface board 103 and the material of the polishing agent 104 are selected according to the material of the bump 102, the rotational speed of the surface board 103 is adjusted to control the amount of polishing and the surface conditions, and the surfaces of the bumps 102 on the semiconductor substrate 101 are polished together with the entire semiconductor substrate 101.
|
