发明名称 METHOD OF PRODUCING SEMICONDUCTOR SILICON SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To achieve selective diffusion to one side of a substrate at a specified high concentration even in an open pipe system by heat-treating the substrate under a mixed gas atmosphere of argon and nitrogen which contains nitrogen within an specified percentage to argon by volume, after heat-treating under an oxidation atmosphere. SOLUTION: A substrate is heat-treated under an oxidation atmosphere. At that time, a part of aluminum on the surface of the substrate becomes aluminum oxide and enters oxide film being formed, a portion of which is diffused as impurity. Subsequently, the atmosphere is changed to a mixed gas of argon and nitrogen which contains 1 part argon and 1-3 parts nitrogen by volume. A specified high concentration is obtained by properly selecting mixing percentage of the gas. If nitrogen is less than 1 part with respect to 1 part argon by volume, then a nitride film can not inhibit out diffusion of aluminum; and if nitrogen is greater than 3 part with respect to 1 part argon by volume, then it is difficult to remove the nitride film in the following process.
申请公布号 JP2000091256(A) 申请公布日期 2000.03.31
申请号 JP19980256459 申请日期 1998.09.10
申请人 NAOETSU ELECTRONICS CO LTD 发明人 TAKEDA KEIICHI;UCHIYAMA TAKESHI;MUTO MIKAKO
分类号 H01L21/225;(IPC1-7):H01L21/225 主分类号 H01L21/225
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