| 摘要 |
PROBLEM TO BE SOLVED: To prevent effectively such troubles as the removal or stripping of inner lead by ensuring sufficient bonding strength of the inner lead to a resin package, while employing a shape where a part of the inner lead is exposed to the outside of the resin package. SOLUTION: A semiconductor chip 11 and an inner lead 12 are sealed in a resin package 10 while being connected through a wire W, where a partial surface of the inner lead 12 is exposed as an outer surface part 12a, to the bottom face 10a of the resin package 10 and the part closer to the semiconductor chip 11 than the outer surface part 12a serves as the bonding part 12b of the inner lead 12 which is to be bonded with one end of the wire W. The bonding part 12b of the inner lead 12 is continuous to the outer surface part 12a and bent toward the upper surface 10b side of the resin package 10 to form a nail head part 12b. |
