发明名称 LASER IRRADIATION EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To perform uniform laser annealing on the whole surface of a substrate to be treated and extend the area of a laser beam on a surface to be formed, by dividing a laser beam in one direction with a lens, superimposing the laser beam by an optical system, and making the boundary of the laser beam to be inputted in the lens, perpendicular to the dividing direction. SOLUTION: The boundary of an almost rectangular laser beam 601 is eliminated by using a slit 610, the laser beam is made straight, and a rectangular laser beam is obtained. The rectangular laser beam is made to enter a cylindrical lens group 603 as an optical system. The laser beam which is made to enter the cylindrical lens group 603 is divided in one direction and superimposed on a surface 609 to be irradiated by a cylindrical lens 604. A slit 610 is so arranged that the boundary of the laser beam is made straight perpendicular to the direction (widthwise direction) divided by the cylindrical lens group 603.
申请公布号 JP2000091264(A) 申请公布日期 2000.03.31
申请号 JP19990144064 申请日期 1999.05.24
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 TANAKA KOICHIRO
分类号 H01L21/268;B23K26/06;B23K26/067;B23K26/073;G02B27/09;H01L21/26;H01S3/00;H01S3/0941 主分类号 H01L21/268
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