| 摘要 |
<p>PROBLEM TO BE SOLVED: To precisely determine the chucked or released condition of a substrate in a vacuum processing device having a high-frequency suppression filter. SOLUTION: The vacuum processing device 2 has high-frequency suppression filters 45a, 45b inserted between chuck electrodes 21a, 21b in an electrostatic chuck plate 20 and DC power supplies 46a, 46b, parallel-connected with by-pass switches 8a, 8b. When a high-frequency voltage is applied to the substrate 8 on the electrostatic chuck plate 20, the by-pass switches 8a, 8b are kept in an open condition, and the high-frequency suppression filters 45a, 45b are inserted into a path where a DC voltage is applied, which prevents high-frequency voltage from invading the DC power supplies 46a, 46b. While the substrate is being chucked or released, a closed condition is kept to measure the current not passing through the high-frequency suppression filters 45a, 45b and determine the chucked or released condition. If the capacitors 52a, 52b grounded in the high-frequency suppression filters 45a, 45b are provided, it is desirable to remove the high-frequency suppression filters 45a, 45b from the current path at the current measurement by forming disconnecting switches 6a, 6b, 7a, 7b.</p> |
