| 摘要 |
PROBLEM TO BE SOLVED: To improve the contllability of the line width of a resist pattern, to suppress occurrence of microbubbles on the interface between the resist and developer, and to decrease developing defects. SOLUTION: This device is equipped with a coating part to apply a resist on a semiconductor substrate, an irradiating part 12 of light to irradiate the resist surface with light (UV rays) to increase hydrophilicity of the resist surface, a projecting part 8 of exposure light to expose the resist through a reticle having a specified pattern as a mask to transfer the pattern of the reticle, and a developing part 11 to supply a developer to the resist to pattern the resist. By using the device, the resist surface is irradiated with light before projecting the exposure light. |
