| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting device with superior reliability without causing excess or shortage of solder, even at mounting various kinds of surface mount electronic components whose outer dimensions, weight and terminal number, etc., are different in coexistence. SOLUTION: In this device 1, on lands 5 and 8 provided on a first surface S1 and second surface S2 of a substrate 2, solder layers 6 and 9 are respectively formed. Through the solder layers 6 and 9, terminals 4a and 7a of the surface mount electronic components 4 and 7 are soldered on the lands 5 and 8. The required solder amount per land of the solder layers 6 and 9 is set to different values on the first surface S1 and on the second surface S2 of the substrate 2.
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