| 摘要 |
PROBLEM TO BE SOLVED: To prevent inclusion of bubbles in a circulation flow path and prevent bubbles from detrimentally affecting wafer treatment when treatment solution temporarily stored in a reservoir tank is supplied again to an immersion tank through a circulation flow path. SOLUTION: The device has an immersion tank 2 for immersing and a wafer W in stored treatment solution, a reservoir tank 3 which collects overflown solution from the immersion tank 2 and stores it temporarily and a circulation flow path 30 which sucks solution stored in the tank 3 from a treatment solution outlet 4 of the collection tank 3 and supplies it to the immersion tank 2. The flow of treatment solution stored in the reservoir tank 3 to the treatment solution outlet 4 is changed, and a suction control board 15 which forms a pool of treatment solution in the treatment solution outlet 4 and a periphery part thereof is fixed to a bottom part of the collection tank 3.
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