发明名称 METHOD AND APPARATUS FOR DETECTION OF BONDING INTERFACE OF OBJECT, TO BE INSPECTED, PROVIDED WITH TRANSPARENT BONDING PART AS WELL AS METHOD AND APPARATUS FOR MANUFACTURE OF LENS BY USING THEM
摘要 PROBLEM TO BE SOLVED: To develop a technique by which the bonding interface of an object, to be inspected, provided with a transparent bonding part can be optically detected automatically, to apply the technique to a method and an apparatus for the manufacture of a lens by performing a drive mold releasing operation, to efficiently manufacture the lens and to lower the cost of the production of the lens. SOLUTION: The inside of a molded body is irradiated with spot light which is radiated from an irradiation lens 51 at a lighting device 50 from the bottom face side of a lower mold 2 at the molded body and from the oblique rear part with reference to an outer circumferential face to be photographed. The angle of irradiation of irradiation light at this time may be set at an angle formed between a direction parallel to the outer circumferential face of the molded body and a direction parallel to the bottom face of the lower mold 2. When the molded body is illuminated from the oblique rear part in an imaging range, the illumination light is introduced once into the inside of the molded body, and the outer circumferential face to be imaged is illuminated from the oblique rear part via the inside of the molded body to be illuminated. As a result, beams of high-luminance light from a bonded edge 1a and a bonded edge 2a can be radiated to an imaging device 4.
申请公布号 JP2000088700(A) 申请公布日期 2000.03.31
申请号 JP19980254412 申请日期 1998.09.08
申请人 SEIKO EPSON CORP 发明人 NAGASAKA MANABU;ONISHI ICHIRO
分类号 B29D11/00;G01M11/00;G01N21/88;G01N21/958;(IPC1-7):G01M11/00 主分类号 B29D11/00
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