| 摘要 |
A heat shield device suitable for use with a soldering device comprises a heat shield and means for moving the heat shield to and from a shielding position in which it shields a target area from a heat source, wherein the movement of the heat shield is mechanically linked to a movement of the heat source in relation to the target area. This device provides the advantage that the shielding of the heat source can be automatically synchronised with the movement of the heat source away from the target, without the need for external control systems. In a preferred embodiment, the heat shield is secured with respect to the heat source by means of a resilient member which provides a biasing force to bias the heat shield away from the shielding position.
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