Electrical or electronic component, e.g. a force, pressure or acceleration sensor, has a substrate with a porous layer for forming a strong joint with a packaging element

摘要

An electrical or electronic component, having a substrate (1) with a porous layer (5) for forming a strong joint with a packaging element (2, 6), is new. Preferred Features: The porous layer (5) consists of a 30-500 microns thick layer of anodically oxidized substrate material, Si, SiGe, SiC or Al.