METHOD FOR PRODUCING ETCHED CIRCUITS

摘要

A method for producing etched printed-circuit boards, characterized by the following steps: (A) both sides of a through-plated copper laminate are coat ed with a negative galvano-resist (4); (B) the resist coating (4) is structured by means of a photographic exposure process, whereby the through-platings (3 ) are covered by a mask, and by means of subsequent development; (C) a metal resist (5) is applied by means of electroplating; (D) the cross-linked negative photo-resist (4) remaining on the laminate is removed; (E) the bare copper (2) is removed by means of an etching solution; and (F) the metal resist is removed by a stripper solution. The inventive method provides through-platings (3) with reduced annular rings.