发明名称 |
Method of prevention of degradation of low dielectric constant gap-fill material |
摘要 |
Patterned metal layers are gap filled with HSQ and passivated to stabilize the dielectric constant of the HSQ substantially at the as-deposited value prior to oxide deposition by PECVD and planarization. Passivation and stabilization are effected by treating the as-deposited HSQ layer in a silane (SiH4) containing plasma.
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申请公布号 |
US6043147(A) |
申请公布日期 |
2000.03.28 |
申请号 |
US19970993119 |
申请日期 |
1997.12.18 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
CHEN, ROBERT C.;SHIELDS, JEFFREY A.;DAWSON, ROBERT;TRAN, KHANH |
分类号 |
C23C16/40;C23C16/56;H01L21/3105;H01L21/312;H01L21/768;(IPC1-7):H01L21/316 |
主分类号 |
C23C16/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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