发明名称 Method of prevention of degradation of low dielectric constant gap-fill material
摘要 Patterned metal layers are gap filled with HSQ and passivated to stabilize the dielectric constant of the HSQ substantially at the as-deposited value prior to oxide deposition by PECVD and planarization. Passivation and stabilization are effected by treating the as-deposited HSQ layer in a silane (SiH4) containing plasma.
申请公布号 US6043147(A) 申请公布日期 2000.03.28
申请号 US19970993119 申请日期 1997.12.18
申请人 ADVANCED MICRO DEVICES, INC. 发明人 CHEN, ROBERT C.;SHIELDS, JEFFREY A.;DAWSON, ROBERT;TRAN, KHANH
分类号 C23C16/40;C23C16/56;H01L21/3105;H01L21/312;H01L21/768;(IPC1-7):H01L21/316 主分类号 C23C16/40
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