| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor compatible with an insertion mounting method and a surface mounting method excellent in ordinary temperature shelf stability, moisture resistance reliability and moldability. SOLUTION: This composition comprises as essential components an epoxy resin, a phenol resin, a tetrasubstituted phosphonium salt of a conjugate base of a compound having at least two phenolic hydroxyl groups in one molecule as a curing accelerator, the electroconductivity of extraction water of which compound being 1,000μS/cm or less, and an inorganic filler, the equivalent ratio of epoxy groups in all the epoxy resins to the phenolic hydroxyl groups in all the phenol resins being 0.5-2 and the amount of the inorganic filler compounded being 200-2,400 pts.wt. based on 100 pts.wt. of the total amount of all the epoxy resins and all the phenol resins.
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