| 摘要 |
PROBLEM TO BE SOLVED: To obtain a plated wire excellent in solder wettability, capable of suppressing the generation of whiskers even in a high temp. environment and contg. no harmful lead by a specified process. SOLUTION: In a hot dip plating bathtub 4, a hot dip plating soln. 5 having a compsn. preferably composed of, by pts.wt., 0.1 to 2.0 copper, and the balance tin with inevitable impurities is held to a prescribed soln, temp., and, furthermore, gaseous nitrogen is introduced as an inert gas 6 from an inert gas introducing tube 8, and the whole of the hot dip plating soln. is coated with a gaseous nitrogen atmospheric layer. Then, a metallic elemental wire 2 is introduced into the hot dip plating soln. via a metallic elemental wire introducing port 9, in the hot dip plating soln. 5, the running direction thereof is switched by a pulley 11, it is pulld out from the soln. face of the hot dip plating soln. 5 to the vertical upper direction, is introduced-out from a plating wire introducing outlet 10 and is cooled by the air to obtain a tin-copper alloy hot dip plated wire 1 having a plating layer of a prescribed thickness.
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