发明名称 ALIGNING METHOD OF CHIP PART AND ALIGNING DEVICE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an aligning method and an aligning device capable of aligning leadless chip parts having front and back surfaces by arranging front and back directions in order by a simple means. SOLUTION: A leadless chip part 4 carried in from a carrier passage is held on a recessed part 3a provided with a 90 deg. angle interval on a peripheral surface of a rotor 1 to rotate around an X axis as its central axis, front and back surface positions of the chip part 4 in this recessed part 3a are discriminated by a sensor 6, the rotor 1 is rotated by 90 deg. at the time when the chip part 4 is in the direction on the front surface side, the chip part is held in a position as it is in the front surface direction and it is carried out from a recessed part 3d through a passage 5 by discharge pressure of air. Additionally, the chip part 4 is carried out from the recessed part 3d by reversing the direction of the chip part 4 by reversing the rotor 1 by 90 deg. at the time when the chip part 4 stored in the recessed part 3a of the rotor 1 is in the reverse direction. Additionally, the chip parts are aligned by arranging their positions in the longitudinal direction in order.
申请公布号 JP2000085951(A) 申请公布日期 2000.03.28
申请号 JP19980255362 申请日期 1998.09.09
申请人 SONY CORP 发明人 SUGIYAMA OSAMU
分类号 H05K13/02;B65G47/248 主分类号 H05K13/02
代理机构 代理人
主权项
地址